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Ships within 48 hours · Estimated delivery Aug 13 - Aug 18
Telecommunications
substrate heating
high durability and easy maintenance
Maximized Energy Savings: A leading-edge product advantage is the specialized energy-saving design
BGA rework
solder paste inspection machine TelecommunicationsProduct overview The Solder Paste Inspection (SPI) Machine is an advanced inline inspection solution designed to ensure high quality solder paste printing in SMT production. By capturing precise 3D images and analyzing solder paste volume, height, area, and shape, the system helps manufacturers detect and correct printing defects early in the process before component placement. With its professional optical design, powerful data processing, and
